CHILION officially launches a PCB-level protection solution based on AFCP micro-capsule technology. Simply put: micron-scale fire suppressant granules placed right next to circuit board heat sources — when temperature rises abnormally, they activate automatically.
In instruments, communications equipment, and industrial controllers, internal space is extremely limited. Traditional fire suppression devices simply can't fit. Yet these confined spaces are precisely where component failure can burn an entire board, writing off the whole device.
CHILION's solution: micron-scale fire suppressant granules using the same AFCP micro-capsule technology — granules are micron-sized, can be embedded directly on PCB surfaces or near heat-generating components. No impact on circuit performance, no extra space required. When temperature rises abnormally, the micro-capsules rupture, releasing clean agent to protect precision circuits.
The suppressant is fluorine shield clean agent — ODP zero, non-conductive, non-corrosive, residue-free. It won't damage circuit boards or affect adjacent component operation.